#SimcenterPhysicalTesting

Simcenter Micred Power Tester combines active power cycling with transient thermal characterization and thermal structure investigation. Perform the non-destructive structure-function assessment while the device is mounted, providing a full electrical and structural assessment of the device.

Rely on a reliable tool
The Simcenter Micred Power Tester supports automatic testing and diagnosis of possible failure causes of power components on the manufacturing floor. The energy demands of both consumer and industrial electronic systems are increasing, and power electronics component suppliers as well as OEMs are faced with the challenge of providing the highly reliable systems needed for aviation, electric vehicles, trains, power generation, and reusable energy production. The Simcenter Micred Power Tester can power the modules through tens of thousands, potentially millions, of cycles while simultaneously providing a real-time failure-in-progress diagnosis.

Receive real-time failure diagnosis
The Simcenter Micred Power Tester is the only machine built for manufacturing as well as laboratory environments that does automated power cycling while producing analytical data for real-time failure-in-progress diagnosis. It’s designed to perform lifetime testing to test the reliability of applications that use power electronic modules.

Accelerate the process
The Simcenter Micred Power Tester is unique since it provides fully automated power testing and cycling at the same time, on the same machine, without having to remove the device under test during the process. A simple touch-screen interface allows a technician to use it on the manufacturing floor and/or failure analysis engineer to use it in the lab.

Simcenter Micred T3STER is an advanced non-destructive transient thermal tester for the thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices. It measures the true thermal transient response more efficiently than steady-state methods. Measurements are to ±0.01° C with up to 1-microsecond time resolution. Structure functions post-process the response into a plot that shows the thermal resistance and capacitance of package features along the heat flow path. Simcenter Micred T3STER is an ideal pre- and post-stress failure detection tool. The measurements can be exported for thermal model calibration, underpinning the accuracy of the thermal design effort.

Enable faster results with just one test
Simcenter Micred T3STER is easy to use and fast. It produces fully reproducible results, so each test only needs to be carried out once. Simcenter Micred T3STER tests packaged ICs using only electrical connections for powering and sensing, giving fast, repeatable results and eliminating the need for multiple tests on the same part. Components can be tested in situ and test results can be used as a compact thermal model or to calibrate a detailed model.

Test all type of packaged semiconductors
Practically all types of packaged semiconductors can be tested, from power diodes and transistors to large and highly complex digital ICs, including parts that are mounted on a board, and even packaged into a product.

Simply put, a power pulse is injected into the component and its temperature response is recorded very accurately against time. The semiconductor itself is used both to power the part and to sense the temperature response using a temperature-sensitive parameter on the die surface such as a transistor or diode structure.

Access reliable software
The software provided with Simcenter Micred T3STER provides a lot of the value of the solution. That’s because the Simcenter Micred T3STER software can take the temperature versus time trace and convert it into what is known as a structure function. Discrete features of the package, such as the die attach can be detected in this plot, making Simcenter Micred T3STER an excellent diagnostic tool in product development. The plot can also be used to calibrate a detailed 3D thermal model in Simcenter Flotherm, creating a thermal model of a chip package that predicts temperature in both space and time with 99+% accuracy.

Simcenter Micred Quality Tester enables the assessment of a semiconductor package thermal structure to identify manufacturing defects, including die attach issues.

Trust in precision
It uses accurate thermal impedance measurement in combination with automatic test equipment. Precise measurement of thermal response to a short power pulse allows high throughput semiconductor testing, including for junction-to-case thermal resistance verification. Junction temperature measurement is via electrical method using built-in Simcenter Micred T3STER technology.

Reach the gold standard
As an IC test handler picks and places devices for test, each device is qualified for automated binning compared to a gold standard thermal impedance curve and preset bandings of variation.